Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same

ABSTRACT

The present invention relates to a method of manufacturing an interconnect device for a printed circuit board. According to one aspect of the present invention, a method of manufacturing an interconnect device comprises forming a protective film pattern on a sacrificial substrate for forming an interconnect device including a first contact section having a bar-like shape for making contact with a second contact terminal in a space transformer, a connecting section having an O-ring-like shape of which one side is opened and connected to one end of the first contact section in an integrated manner, a support section having an engaging protrusion in a predetermined portion and connected to one end of the connecting section in an integrated manner, and a second contact section having an O-ring-like shape and connected to one end of the support section in an integrated manner; filling a conductive material into the inside of the protective pattern, and removing the protective film pattern and the sacrificial substrate to finish the interconnect device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional Application of U.S. patent applicationSer. No. 10/547,231 filed on Aug. 26, 2005, now U.S. Pat. No. 7,306,493which is a National Stage application under 35 U.S.C. §371 and claimsthe benefit of International Application No. PCT/KR2003/001413, filed onJul. 16, 2003, published in the English language on Sep. 10, 2004 asInternational Publication Number WO 2004/077623 A1, which claimspriority to Korean Application No. 10-2003-0012673, filed on Feb. 28,2003, all of which are hereby incorporated herein by reference in itsentirety.

FIELD OF THE INVENTION

The present invention relates to an interconnect device for a printedcircuit board, a method of manufacturing the same, and an interconnectassembly having the same, and more specifically to an interconnectdevice for a printed circuit board which holds resilient forces as wellas electrically interconnects an upper substrate with a lower substrate,a method of manufacturing the same and an interconnect assembly havingthe same.

BACKGROUND OF THE INVENTION

Typically, a semiconductor device is implemented on a wafer by repeatingwafer processes such as an oxidation process, a diffusion process, anetching process, and a metallization process, and then slicing andpackaging processes are performed to make a shipment. In addition, thesemiconductor device implemented on the wafer is subject to a probingtest for verifying whether it is acceptable or not after completing thewafer processes but before slicing them.

In such a probing test, predetermined electrical signals are appliedfrom a test equipment through probe tips of a probe card coupled withelectrode pads in the chips on the wafer and then the correspondingoutput electrical signals are received to test whether the chips on thewafer are acceptable or not.

Also, in such a probing test for testing whether chips on the wafer areacceptable or not, it is typical to use a probe card which comprisesprobe tips corresponding to the lay-out of the probed (i.e., each ofpads implemented on a semiconductor substrate).

As seen in Korean Patent Application No. 2001-0074710, in a conventionalprobe card assembly 500, a probe pin or a contact element 524 makescontact with the bonding pads 526 on the semiconductor wafer 508.

The probe card assembly includes several elements which are assembledtogether, including a probe card 502, an interposer 504, and a spacetransformer 506. The probe card 502 is typically a printed circuit boardwhich includes circuit traces to various electrical components which areused in performing the electrical tests of the semiconductor die beingprobed.

Contact elements on the probe card 502 make contact with the bondingpads 526 through a series of intervening layers including the interposer504 and the space transformer 506.

The interposer 504 provides for a resilient or spring-like positioningin the vertical or z direction in order to provide adequate contact forall contact elements at the bonding pads regardless of the length of thecontact elements used on the intervening layers, such as the contactelements 524 which resemble springs. The space transformer 506 performsa pitch reduction and is also the substrate on which resilient contactelements are disposed.

In more detail, the interposer assembly 300 has a substrate 302 on whichresilient contact elements are attached, including contact elements 312,314, 316, and 318. Contact elements 312 and 316 are electrically coupledfrom one side of interposer 300 to the other side by a through connect304A, and contact elements 314 and 318 are electrically coupled by athrough connect 306A.

Accordingly, contact elements such as springs in the interposer 504assembly 300 are attached to the substrate 302 by a wire boding processor the like. Therefore, a process of fabricating the assembly is verydifficult and causes a lot of processing time losses.

Particularly, the wire bonding process for the resilient contactelements such as springs is performed two times for both top and bottomsurfaces of the substrate 302. This makes the process more difficult andcauses more processing time losses.

Along with the above problems, since the resilient contact elements suchas springs are attached to both top and bottom surfaces of the substrate302 by the wire bonding process or the like, the attached portions canbe easily deteriorated. In addition, since the resilient contactelements such as springs are attached to both top and bottom surfaces ofthe substrate, the total path length of the electrical signal increasesso that electrical noises can easily occur.

In addition, since the probe card assembly comprises an element, theinterposer which includes the substrate, the total cost of manufacturingthe probe card assembly increases.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide aninterconnect device for a printed circuit board, a method ofmanufacturing the same, and an interconnect assembly having the samewhich are capable of omitting the wire bonding process for attaching theresilient contact elements such as springs to the substrate so as tosolve related problems such as difficulties in the manufacturingprocesses caused by the bonding process.

Another object of the present invention is to provide an interconnectdevice for a printed circuit board, a method of manufacturing the same,and an interconnect assembly having the same which are capable ofpreventing deterioration of the substrate portions corresponding to theresilient contact elements such as springs and occurrence of electricalnoises by reducing total path length of the electrical signal.

Still another object of the present invention is to provide aninterconnect device for a printed circuit board, a method ofmanufacturing the same, and an interconnect assembly having the samewhich are capable of reducing the cost of manufacturing the entire probecard assembly by omitting the interposer and the substrate from theprobe card assembly.

In order to achieve the above objects, the interconnect device 2 for aprinted circuit board according to one aspect of the present inventioncomprises: a first contact section 10 having a bar-like shape for makingcontact with a second contact terminal 76 in a space transformer 52; aconnecting section 12 having an O-ring-like shape of which one side isopened and connected to one end of the first contact section 10 in anintegrated manner; a support section 14 having an engaging protrusion 14a in a predetermined portion and connected to one end of the connectingsection 12 in an integrated manner; and a second contact section 16having an O-ring-like shape and connected to one end of the supportsection 14 in an integrated manner, wherein the whole interconnectdevice is made up of an identical resilient material.

According to another aspect of the present invention, a method ofmanufacturing an interconnect device for a printed circuit boardcomprises steps of: forming a protective film pattern on a sacrificialsubstrate for forming an interconnect device including a first contactsection 10 having a bar-like shape for making contact with a secondcontact terminal 76 in a space transformer, a connecting section 12having an O-ring-like shape of which one side is opened and connected toone end of the first contact section 10 in an integrated manner, asupport section 14 having an engaging protrusion in a predeterminedportion and connected to one end of the connecting section 12 in anintegrated manner, and a second contact section 16 having an O-ring-likeshape and connected to one end of the support section 14 in anintegrated manner; filling a conductive material 26 into the inside ofthe protective pattern 24; and removing the protective film pattern 24and the sacrificial substrate 20 to finish the interconnect device.

According to still another aspect of the present invention, aninterconnect assembly having an interconnect device for a printedcircuit board comprises: a printed circuit board 40 including a contacthole 70 in which a conductive film 72 connected to an internal circuitryis formed on the inside wall; a first guide film 60 fixed on a bottomsurface of the printed circuit board 40 and having a first guide opening66 to open the contact hole 70; a space transformer having a secondcontact terminal 76 on a top portion and a bump 64 in the vicinity ofthe second contact terminal 76; a second guide film 62 fixed on thespace transformer 52, supported by the bump 64, and having a secondguide opening 68 to be related with the bump 64; and an interconnectdevice 2 including a second contact section having an O-ring-like shapeto be inserted into the contact hole 70 by an interference fit, asupport section having an engaging protrusion in a predetermined portionand connected to the second contact section in an integrated manner tobe inserted into the inside of the first guide opening, a connectingsection having an O-ring-like shape of which one side is opened andconnected to the support section in an integrated manner thereby beingplaced between the first guide film and the second guide film, and afirst contact section connected to the connecting section in anintegrated manner for making contact with the second contact section 76through the second guide opening.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, advantages and features of the presentinvention will become apparent from the following description ofpreferred embodiments given in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view of an interconnect device according to anembodiment of the present invention;

FIGS. 2 a, 2 b, and 2 c are cross sectional views for explaining amethod of manufacturing an interconnect device according to anembodiment of the present invention;

FIG. 3 is a cross sectional view for explaining an interconnect deviceaccording to an embodiment of the present invention;

FIG. 4 is a cross sectional view for explaining the assembled relationof the interconnect devices shown in FIG. 3 in more detail; and

FIG. 5 is a perspective view of an interconnect device according toanother embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In order to achieve the above objects, the interconnect device 2 for aprinted circuit board according to one aspect of the present inventioncomprises: a first contact section 10 having a bar-like shape for makingcontact with a second contact terminal 76 in a space transformer 52; aconnecting section 12 having an O-ring-like shape of which one side isopened and connected to one end of the first contact section 10 in anintegrated manner; a support section 14 having an engaging protrusion 14a in a predetermined portion and connected to one end of the connectingsection 12 in an integrated manner; and a second contact section 16having an O-ring-like shape and connected to one end of the supportsection 14 in an integrated manner, wherein the whole interconnectdevice is made up of an identical resilient material.

Now, each element of the interconnect device 2 will be described indetail with reference to the accompanying drawings.

First, the interconnect device 2 is made up of a conductive materialsuch as Ni or Ni alloy so as to exhibit desirable resilience.

(1) First Contact Section:

The first contact section 10 has a bar-like shape. As shown in FIG. 1,the first contact section 10 is slanted at 0° to 10° toward theconnecting section 12 on the basis of the central axis 18 of theinterconnect device.

In addition, the tip 10 a of the first contact section 10 is formed tobe sharp in order to increase contact ability when the tip makes contactwith the contact terminal in the space transformer.

(2) Connecting Section:

The connecting section 12 is connected to one end of the first contactsection 10 in an integrated manner. Also, the connecting section 12 ismade up of the same material as the first contact section 10 and has anO-ring-like shape of which one side is opened.

In addition, as recognized in FIG. 5, the connecting section 12 has amulti-bent spring-like shape.

(3) Support Section:

The support section 14 is connected to one end of the connecting section12 in an integrated manner. Also, the support section 14 is made up ofthe same material as the connecting section 12 and has an engagingprotrusion 14 a in a predetermined portion as shown in FIG. 1.

(4) Second Contact Section:

The second contact section 16 is connected to one end of the supportsection 14 in an integrated manner. Also, the second contact section 16is made up of the same material as the support section 14 and has anO-ring-like shape.

In addition, the second contact section 16 has a protruding portion 16 aat its end as shown in FIG. 1.

According to another aspect of the present invention, a method ofmanufacturing an interconnect device for a printed circuit boardcomprises steps of: forming a protective film pattern on a sacrificialsubstrate for forming an interconnect device including a first contactsection 10 having a bar-like shape for making contact with a secondcontact terminal 76 in a space transformer, a connecting section 12having an O-ring-like shape of which one side is opened and connected toone end of the first contact section 10 in an integrated manner, asupport section 14 having an engaging protrusion in a predeterminedportion and connected to one end of the connecting section 12 in anintegrated manner, and a second contact section 16 having an O-ring-likeshape and connected to one end of the support section 14 in anintegrated manner; filling a conductive material 26 into the inside ofthe protective pattern 24; and removing the protective film pattern 24and the sacrificial substrate 20 to finish the interconnect device.

Now, a method of manufacturing an interconnect device for a printedcircuit board according to the present invention will be described indetail for each step.

(1) Step of Forming a Protective Film Pattern:

This step is to shape the interconnect device 2.

First, a seed layer 22 is formed on a sacrificial substrate 20. Then,the protective film pattern 24 is formed by coating a photo resisthaving a predetermined thickness on the seed layer and then performingexposure and development using a mask having the same shape as theinterconnect device. In this case, the seed layer is made up of amaterial including Cu and formed by sputtering.

As a result of this step, the groove having the shape of theinterconnect device is formed on the sacrificial substrate 20.

(2) Step of Filling a Conductive Material:

This step is to fill a conductive material into the groove on theprotective film pattern 24 formed in the step of forming a protectivefilm pattern.

In more detail, a conductive material 26 capable of exhibiting desirableresilience is filled into the groove in the protective film patternhaving the shape of the interconnect device on the sacrificialsubstrate. In this case, a planarization process is performed afterfilling the conductive material 26 if the conductive material 26 isfilled to excess the heights of other portions of the photo resist onthe sacrificial substrate 20.

Also, the conductive material 26 is made up of a material including Nior Ni alloy.

(3) Step of Finishing the Interconnect Device:

This step is to finish the interconnect device.

First, the protective film pattern 26 made up of a material such as aphoto resist on the sacrificial substrate 20 is removed by wet etchingor the like using a chemical material so that the conductive material 26having the shape of the interconnect device is exposed on thesacrificial substrate 20.

Then, the seed layer 22 and the sacrificial substrate 20 are removed bywet etching or the like using a chemical material so that theinterconnect device made up of a conductive material is finished.

According to still another aspect of the present invention, aninterconnect assembly having an interconnect device for a printedcircuit board comprises: a printed circuit board 40 including a contacthole 70 in which a conductive film 72 connected to an internal circuitryis formed on the inside wall; a first guide film 60 fixed on a bottomsurface of the printed circuit board 40 and having a first guide opening66 to open the contact hole 70; a space transformer having a secondcontact terminal 76 on a top portion and a bump 64 in the vicinity ofthe second contact terminal 76; a second guide film 62 fixed on thespace transformer 52, supported by the bump 64, and having a secondguide opening 68 to be related with the bump 64; and an interconnectdevice 2 including a second contact section having an O-ring-like shapeto be inserted into the contact hole 70 by an interference fit, asupport section having an engaging protrusion in a predetermined portionand connected to the second contact section in an integrated manner tobe inserted into the inside of the first guide opening, a connectingsection having an O-ring-like shape of which one side is opened andconnected to the support section in an integrated manner thereby beingplaced between the first guide film and the second guide film, and afirst contact section connected to the connecting section in anintegrated manner for making contact with the second contact section 76through the second guide opening.

Now, an interconnect assembly for a printed circuit board according tothe present invention will be described in detail for each element.

(1) Printed Circuit Board:

The printed circuit board 40 includes a plurality of contact holes 70. Aconductive film 72 made up of a conductive material is formed on theinside wall of each contact hole 70.

In addition, a first contact terminal 74 made up of a conductivematerial is formed in the peripheral portion of each contact hole 70 onthe bottom surface of the printed circuit board 40. Also, a first guidefilm 60 is fixed on the bottom surface of the printed circuit board 40having the first contact terminal 74 by using an attaching means such asan adhesive, and includes a plurality of first guide openings 66.

(2) Space Transformer:

The space transformer 52 is installed within a predetermined distancefrom the bottom surface of the printed circuit board 40. Also, the spacetransformer 52 includes a plurality of second contact terminals 76. Inaddition, a predetermined number of bumps 64 are included in thevicinity of the second contact terminal 76.

A second guide film having second guide openings 68 is fixed on the topportion of the bump by an attaching means such as an adhesive. In thiscase, the second guide film 62 is fixed in such a way that the secondguide openings 68 are related with the second contact terminals 76.

(3) Interconnect Device:

Herein, it is preferable to use the interconnect device 2 manufacturedaccording to the aforementioned manufacturing method.

In this case, the first contact section 10 of the interconnect device 2makes contact with the second contact terminal 76, whereas the secondcontact section 16 makes contact with the contact hole 70 in the printedcircuit board 40.

(4) Other Elements:

As recognized in the FIG. 3, in the aforementioned interconnect assemblyfor a printed circuit board, the first and second reinforcement plates42 and 46 are attached to the top and bottom surfaces of the printedcircuit board 40, respectively. The first and second reinforcementplates 42 and 46 are fixed by the bolts 44.

In this case, the second reinforcement plate 46 is connected to thethird reinforcement plate 48 attached to the space transformer 52 by theplate spring 50.

By means of the second reinforcement plate 46, a predetermined distancecan be maintained between the printed circuit board 40 and the spacetransformer 52.

The first and second guide films are made up of a non-conductivepolyimide material.

Now, the most preferred embodiment of the present invention will bedescribed in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view for explaining the interconnect device fora printed circuit board according to the most preferred embodiment ofthe present invention.

As shown in FIG. 1, the interconnect device 2 for a printed circuitboard according to the present invention comprises the first contactsection 10, the connecting section 12, the support section 14, thesecond contact section 16, and the protruding portion 16 a in anintegrated manner. The first contact section 10, the connecting section12, the support section 14, the second contact section 16 and theprotruding portion 16 a are made up of a material having desirableresilience such as Ni—Co alloy.

Also, as recognized in FIG. 1, the first contact section 10 is slantedat 0° to 10° toward the connecting section 12 on the basis of thecentral axis 19 of the interconnect device. In this case, the tip 10 aof the first contact section 10 having a bar-like shape is formed to besharp so as to make contact with the contact terminal 76, and the firstcontact section 10 has a total length D₁ of about 1 mm.

In addition, the connecting section 12 is connected to the first contactsection 10 in an integrated manner and has an O-ring-like shape of whichone side is opened so as to be compressed or stretched by its resilientactivity. Here, the connecting section 12 has a total length D₂ of about2 to 3 mm.

In this case, the total length D₅ between the end of the first contactsection 10 and the end of the center portion of the connecting section12 is set to about 2 to 3 mm. Also, the connecting section 12 having anO-ring-like shape of which one side is opened may have a multi-bentstructure so as to be compressed or stretched by its spring-likeactivity.

Moreover, the support section 14 is connected to one end of theconnecting section 12 in an integrated manner and has the shape of athin rectangular plate having an engaging protrusion 14 a in its lowerportion so as to be engaged with the hole. In this case, the supportsection 14 has a total length D₃ of about 0.5.

In addition, the second contact section 16 is connected to one end ofthe support section 14 in an integrated manner. Specifically, the secondcontact section 16 has a long hollow O-ring-like shape having a centralopening in its internal portion and a protruding portion 16 a in its endso that a resilient force can be exerted by physical forces generated onits sides when the second contact section is inserted into the contacthole 70. Also, the second contact section 16 has a total length D₄ ofabout 5 mm.

FIGS. 2 a to 2 c are the cross sectional views for explaining a methodof manufacturing the interconnect device for a printed circuit boardaccording to a preferred embodiment of the present invention.

Now, a method of manufacturing the interconnect device for a printedcircuit board according to the most preferred embodiment of the presentinvention will be described in detail with reference to the accompanyingdrawings.

First, as shown in FIG. 2 a, the sacrificial substrate 20 made up ofsilicon or the like is prepared and the seed layer 22 made up of amaterial including Cu or the like is formed on the sacrificial substrate20 by a deposition process such as sputtering.

In addition, the protective film pattern 24 made up of a photo resist orthe like is formed by coating the photo resist having a predeterminedthickness on the seed layer 22 and then performing exposure anddevelopment using a mask for forming the interconnect device 2 havingthe shape shown in FIG. 1. In this case, the photo resist has athickness of 100 to 200 μm. Most preferably, the photo resist has athickness of 140 μm.

Next, as shown in FIG. 2 b, the groove on the protective film patternformed on the sacrificial substrate 20 is filled with a conductivematerial 26 such as Ni or Ni alloy, e.g., Ni—Co or Ni—W—Co which canexhibit desirable resilience, and then the top surface of thesacrificial substrate 20 is planarized.

In this case, chemical mechanical polishing (CMP) or grinding can beused for the planarization process. However, the planarization processcan be omitted when the plating process is ideally performed so thatonly the inside of the opening portion of the protective film pattern 24is filled with a conductive material 26.

Particularly, the preceded step of forming the seed layer 22 can beomitted when the conductive material 26 is deposited by other methodssuch as physical vapor deposition (PVD) or chemical vapor deposition(CVD) instead of the plating process.

Then, as shown in FIG. 2 c, the protective film pattern 24 made up of aphoto resist or the like on the sacrificial substrate 20 is removed bywet etching or the like using a chemical material so that the conductivematerial 26 is exposed on the sacrificial substrate 20. Accordingly, theinterconnect device 28 shown in FIG. 1 is exposed on the sacrificialsubstrate 20.

Subsequently, the interconnect device 28 for a printed circuit board isfinished by removing the seed layer 22 and the sacrificial substrate 20by wet etching or the like using a chemical material.

As a result, the interconnect device 28 for a printed circuit board hasexcellent reproducibility and productivity because a semiconductormanufacturing technique is used.

FIG. 3 is a cross sectional view for explaining an assembly includingthe interconnect device 2 for a printed circuit board according to themost preferred embodiment of the present invention, and FIG. 4 is across sectional view for explaining the assembled relation of theinterconnect device 2 shown in FIG. 3 in more detail.

As shown in FIGS. 3 and 4, the assembly including the interconnectdevice for a printed circuit board according to the present invention,that is, a probe card has such a structure that the space transformer 52having a plurality of probes 54 attached on the bottom surface for adirect contact with the probed and the printed circuit board 40 having aplurality of contact holes 70 connected to the internal circuit areelectrically connected via the aforementioned interconnect device 2 bymeans of several subsidiary elements such as the first reinforcementplate 42, the second reinforcement plate 46, the third reinforcementplate 48, the plate spring 50, and the bolts 44, 50, and 58.

Now, the relation between the printed circuit board 40 and the spacetransformer 52 which are assembled by the interconnect devices will bedescribed with reference to FIG. 4.

The printed circuit board 40 comprises a plurality of contact holes 70in which the conductive films 72 including a conductive material such asCu are formed on their inside walls so as to be connected to theinternal circuitry. Also, the first contact terminals 74 made up of aconductive material such as Cu are included in the peripheral portionsof the contact holes 70 on the bottom surface of the printed circuitboard 40.

In addition, the first guide film 60 having a plurality of first guideopenings 66 is fixed on the bottom surface of the printed circuit board40 by using an attaching means such as an adhesive.

In this case, the first guide openings 66 on the first guide film 60 areformed to entirely open the contact holes 70 and the first contactterminals 74, and the diameter of the first guide opening 66 is made tobe larger than that of the contact hole 70.

This is because the first guide opening 66 plays a role in guiding thesecond contact section 16 of the interconnect device into the inside ofthe contact hole 70. In other words, the first guide opening 66 allowsthe second contact section 16 of the interconnect device 2 to beprecisely inserted into the inside of the contact hole 70 even if thelocation of the contact hole 70 is somewhat deviated by imperceptibleerrors in the manufacturing process.

In addition, the space transformer 52 having a plurality of secondcontact terminals 76 is placed within a predetermined distance from thebottom surface of the printed circuit board 40, and bumps are disposedin the vicinity of the second contact terminal 76.

Herein, the second guide film 62 having the second guide openings 68 isfixed on the bumps 64 by using an attaching means such as an adhesive.The second guide film 62 is fixed to relate the second guide opening 68with the second contact terminal 76.

In addition, as shown in FIG. 1, the second contact section 16 of theinterconnect device 2 is inserted into the inside of the contact hole70.

In this case, since the second contact section 16 of the interconnectdevice 2 has a long hollow O-ring-like shape which causes resilience,the second contact section 16 is tightened when it is inserted into theinside of the contact hole 70 from the protruding portion 16 a by aninterference fit, whereby it can make strong contact with the conductivefilm 72 in the inside of the contact hole 70 by its resilient force. Theinterference fit means a method of forcibly inserting the second contactsection having a diameter greater than the contact hole 70 into thecontact hole 70 by external forces.

Then, the engaging protrusion 14 a of the support section 14 makescontact with the first contact terminal 74 in the peripheral portion ofthe contact hole 70 when the second contact section 16 is fully insertedinto the contact hole 70.

Also, the connecting section 12 is placed in the gap between the printedcircuit board 40 and the space transformer 52. The first contact section10 makes contact with the second contact terminal 76 under the guidanceby the second guide opening 68 included in the aforementioned secondguide film 62.

In this case, the second contact terminal 76 makes contact with thefirst contact section 10 when the space transformer 52 is engaged withthe printed circuit board 40 by using the third reinforcement plate 48,the bolts, and the like after the interconnect device 2 is inserted intothe contact hole 70 in the printed circuit board 40.

Particularly, since the first contact section 10 of the interconnectdevice is slanted at 0° to 10° toward the connecting section on thebasis of the central axis 18 of the interconnect device, the tip 10 a ofthe first contact section 10 can make accurate contact with the secondcontact terminal 76 even if the connecting section 12 is somewhat bentby external forces and the position of the first contact section 10 issomewhat deviated when the first contact section 10 makes contact withthe second contact terminal 76 through the guide opening 68.

INDUSTRIAL AVAILABILITY

According to the present invention, the printed circuit board iselectrically connected to the space transformer just by inserting theinterconnect devices into the insides of the contact holes on theprinted circuit board. Therefore, it is possible to solve theconventional problems such as difficulties in the manufacturing processaccompanied by the bonding process.

Particularly, it is possible to originally prevent occurrence ofelectrical noises generated by the deterioration of the bonding portionsbecause there is no bonding portions by omitting a bonding process.

In addition, it is possible to reduce the cost of manufacturing a probecard assembly by omitting the conventional interposers and adapting theinterconnect devices produced by a MEMS process.

Furthermore, it is possible to manufacture constant quality of productsin a large number and ensure high reproducibility because theinterconnect devices are manufactured by a micro electro mechanicalsystem (MEMS) process.

Although the present invention and its advantages have been described indetail, it should be understood that the present invention is not limitto the aforementioned embodiment and the accompanying drawings and itshould be understood that various changes, substitutions and alterationscan be made herein by the skilled in the arts without departing from thesprit and the scope of the present invention as defined by the appendedclaims.

1. A method of manufacturing an interconnect device for a printedcircuit board, comprising steps of: forming a protective film pattern onan even surface of a sacrificial substrate for forming an interconnectdevice including a first contact section having a bar shape for makingcontact with a second contact terminal in a space transformer, aconnecting section having an O-ring shape of which one side is openedand connected to one end of the first contact section in an integratedmanner, a support section having an engaging protrusion in apredetermined portion and connected to one end of the connecting sectionin an integrated manner, and a second contact section having an O-ringshape and connected to one end of the support section in an integratedmanner, wherein the O-ring shape of the second contact section istightened when the second contact section is inserted into a contacthole in a printed circuit board by an interference fit; filling aconductive material into the inside of the protective film pattern,wherein the conductive material in the protective film pattern beinglocated in substantially the same plane as the protective film pattern;and removing the protective film pattern and the sacrificial substratefrom the conductive material to finish the interconnect device, whereinthe connecting section is placed in a gap between the printed circuitboard and the space transformer and the connecting section is compressedor stretched by external force between the printed circuit board and thespace transformer.
 2. The method of manufacturing an interconnect devicefor a printed circuit board according to claim 1, wherein the protectivefilm pattern is formed by coating a photo resist having a predeterminedthickness on the sacrificial substrate and then performing exposure anddevelopment.
 3. The method of manufacturing an interconnect device for aprinted circuit board according to claim 1, wherein the conductivematerial is made up of a metallic material including Ni or Ni alloy. 4.The method of manufacturing an interconnect device for a printed circuitboard according to claim 1, wherein a seed layer is formed on thesacrificial substrate and then the conductive material is formed on theseed layer by a plating method.
 5. The method of manufacturing aninterconnect device for a printed circuit board according to claim 4,wherein the seed layer is formed by sputtering and made up of a materialincluding Cu.